Change in surface area and dissolution rates during hornblende dissolution at
pH 4.0
Hailin Zhang*,
Paul R. Bloom and Edward A. Nater
Department of Soil Science,
University of Minnesota, St. Paul, MN 55108, USA
Received 10 June
1991; accepted 15 October 1992. ; Available online 31 March 2003.
Abstract
Four particle-size fractions (0.045–0.075, 0.075–0.11, 0.11–0.25, and
0.50–1.00 mm sieve sizes) were used to study the relationships of bulk
dissolution rates (mol g−1s−1) to particle size and
measured specific surface area. All reactions were performed on sonically
cleaned samples in pH 4.0, 0.01 M HOAc-LiOAc buffer at 298 K. To minimize the
effects of grinding, dissolution rates were not determined until 30 days of
weathering had occurred; subsequent bulk dissolution rates were still nonlinear
with time and the reaction was incongruent. Bulk reaction rates were higher for
the smaller particle size fractions. The rates of release of Al, Fe, and Mg were
first order with respect to surface area, but the order of release for Si was
0.39. These results suggest that the direct relationship between the quantity of
exposed crystalline defects and dissolution rates suggested by previous
investigators does not hold true for hornblende. The surface area of hornblende
grains increased 99% on average during the first 30 days of weathering, and an
additional 12% during the next 29 days of weathering. Scanning electron
micrographs and N2 adsorption-desorption isotherms (77 K) indicated
that the formation of etch pits and hollow dissolution cores contributed to the
increased surface area. High resolution TEM observations of surface materials
removed by ultrasonic treatment and N2 adsorption hysteresis data
suggest weathering along cleavage planes with the formation of 0.5–13 nm pores.
Most of the increased adsorption of N2 in the surface area
determinations, however, was due to the formation of larger etch features.
*
Present address: Agricultural Testing and Research Lab., Navajo
Agricultural Products Industry, Farmington, NM 87499, USA.